The technical papers will be presented in 7 Technical Sessions, beginning Tue August 1 at 8AM, and ending at nood Friday August 4. There will be free time for sightseeing in the afternoons, and shorter technical sessions in the evenings. The papers will not be grouped by specialization, but interspersed for interest; all sessions should have papers of interest to all participants. A partial list of talks follows.
Prof. William Oldham and Prof. Andrew Neureuther
University of California Berkeley
Workshop Program Co-Chairmen
| Speaker |
Title |
| Keynote Speaker |
| Roxann Engelstad (U Wisc.) |
Thermomechanical Simulations to Facilitate the Development of Advanced Lithography |
| Professor Roxann Engelstad received her Ph.D. in Engineering Mechanics from the University of Wisconsin – Madison in 1988. She joined the faculty of the U.W.-M. Mechanical Engineering Department after her Ph.D., and in 1998 established the Computational Mechanics Center within the College of Engineering. Her primary research area involves the mechanical modeling of components and processes for advanced lithographic techniques, such as mechanical deformations of advanced X-Ray and EUV masks and also fluid flows in Immersion and Imprint lithography. |
| |
| Optics |
| Chairs: John Bruning, Corning |
| Griff Resor (Resor Associates) |
Flat Panel Lithography |
| John Burnett (NIST) |
High-Index DUV Optical Materials |
| Roger French (Dupont) |
Second Generation Fluids For 193 nm Immersion Lithography: Optics, Imaging and Fluid Lifecycle |
| Reiner Garreis (Zeiss) |
Catadioptric Optics Enabling Ultra-high-NA Lithography |
| |
| Optical Lithography |
| Chairs: Tim Brunner, IBM |
| David Laidler (IMEC) |
Overlay Performance of an ASML Immersion Step and Scan Tool |
| Tatsuhiko Higashiki (Toshiba) |
Status and Future of Immersion Lithography |
| Dan Sanders (IBM) |
Oil or Water: What’s the Difference for 193 nm Immersion Lithography? |
| Prof. Bruce Smith (RIT) |
Lithography using the Evanescent Field - Is it Worth the Frustration? |
| Mike Lercel (Sematech) |
A Deep Dive into Extension of Immersion Lithography |
| Bill Arnold (ASML) |
Prospects and challenges for double exposure /double patterning |
| |
| Maskless Lithography |
| Chairs: Nick Eib, LSI Logic / Olav Solgaard, Stanford University |
| Daniel Lopez (Bell Labs) |
MEMS-based Spatial Light Modulators for Optical Maskless Lithography |
| Hank Smith (MIT) |
Zone-Plate-Array Lithography; for Mask Making, Research and Low- Volume Production |
| Tor Sandstrom (Micronic) |
SLM Lithography: Towards Real-time OPC and Inverse Rasterisation |
| |
| EUV Lithography |
| Chairs: Alan Stivers, Intel / Patrick Naulleau, Lawrence Berkeley Natl. Lab |
| Takaharu Miura (Nikon) |
Nikon EUVL Development Status |
| Alan Stivers (Intel) |
EUVL Transition to High Volume Manufacturing |
| Bruno LaFontaine (AMD) |
Masks, Resists and other Challenges of EUV Lithography |
| Joseph Pankert (Philips) |
Light sources for EUV Lithography |
| |
| E-beam Lithography |
| Chairs: Fabian Pease, Stanford University |
| Bert Jan Kampherbeek (Mapper) |
MAPPER: High Througput Maskless Lithography |
| Hitoshi Sunaoshi (Nuflare ) |
Enabling Technologies to Extend E-beam Mask Writing |
| Dan Pickard (Stanford) |
Options for High-speed Electron-beam Lithography |
| |
| Imprint Lithography |
| Chairs: Grant Willson, University of Texas at Austin |
| Grant Willson (UT Austin) |
Imprint Lithography for Dual Damascene |
| Jim Ellenson (HP) |
Imprint Lithography:Getting to the Next Level |
| Hiroshi Ito (IBM) |
Material Design for Step-and-Flash Nanoimprint Lithography |
| |
| Masks and Infrastructure |
| Chairs: Brian Grenon, Grenon Consulting |
| Juan Schneider (Nanometrix) |
Deposition of Ultra-uniform Photoresist Films |
| Patrick Martin (Photronics) |
If Mask Makers Ruled the Universe |
| Larry Zubrick (KLA-Tencor) |
Reticle Inspection Challenges for 45nm and Below |
| Franklin Kalk (Toppan) |
Lifting Lithography's Wedding Veil of Haze |
| Chris Progler (Photronics) |
Masks for Large Area FPD Lithography |
| |
| Resists and Beyond |
| Chairs: Juan de Pablo, University of Wisconsin-Madison / Chris Ober, Cornell University |
| Paul Nealey (Wisc) |
Enhanced information transfer in the lithographic process using block copolymer resists |
| Chuck Black (IBM) |
Sub-Lithographic Patterning Using Polymer Self Assembly |
| Caroline Ross (MIT) |
Templated Self-assembly of Block Copolymers for Lithographic Applications |
| George Barclay (Rohm&Hass) |
A New Materials Approach for 193 Immersion Lithography - Defect and
Leaching control |
| Ralph Dammel (AZ) |
Ultrathin Resists for Immersion and EUV: Reflectivity Control, Integration and Fundamental Issues |
| Chris Ober (Cornell) |
Molecular Glass Resists: Do we need Polymers Anymore? |
| Tsutumu Shimokawa (JSR) |
Recent Progress of ArF Lithography Materials Development |
| |
| DFM and Statistical Variation |
| Chairs: Luigi Capodieci, AMD / Frank Schellenberg, Mentor Graphics / Lars Liebmann, IBM / Jim Wiley, Brion Technologies |
| Andres Torres (Mentor Gr) |
Litho Friendly Design as the Precursor to Improved Electrical Analysis |
| Peter Rabkin (Xylinx) |
Fabless/Foundry DFM - Challenges and Solutions |
| Dario Gil (IBM) |
Design for RET-Enabled Manufacturing |
| Jun Ye (Brion) |
Applied Image Computing for Computational Lithography |
| Mark Mason (TI) |
Litho-Aware Model-Based Design Rule Checking for 45nm Node |
| Tom Wallow (AMD) |
Photoresist LER Reduction in Lithographic and Etch Processing |
| |
| Beyond Chip Lithography |
Chairs: Jeff Bokor, UC Berkeley |
| Eli Yablonovich (UCLA) |
Plasmonics, Optical Frequencies but with X-ray Wavelengths |
| Rick Dill (Hitachi) |
CMP Assisted Patterning |
| Vivek Subramanian (UCB) |
Droplet-on-demand Lithography: An Enabling Technology for Low-cost Electronics |
